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 LESHAN RADIO COMPANY, LTD.
Silicon Pin Diode
These devices are designed primarily for VHF band switching applications but are also suitable for use in general-purpose switching circuits. They are supplied in a cost-effective plastic package for economical, high-volume consumer and industrial requirements. They are also available in surface mount. * Long Reverse Recovery Time t rr = 300 ns (Typ) * Rugged PIN Structure Coupled with Wirebond Construction for Optimum Reliability * Low Series Resistance @ 100 MHz -- R S = 0.7 Ohms (Typ) @ I F = 10 mAdc * Reverse Breakdown Voltage = 200 V (Min)
MMBV3700LT1
SILICON PIN SWITCHING DIODE
3
1 2
3 CATHODE
1 ANODE
CASE
318-08, STYLE8
SOT- 23 (TO-236AB)
MAXIMUM RATINGS(EACH DIODE)
Rating Reverse Voltage Device Dissipation @T A = 25C Derate above 25C Junction Temperature Storage Temperature Range Symbol VR PD TJ T stg MV21XX MMBV21XXLT1 200 280 200 2.8 2.0 +150 -55 to +150 Unit Vdc mW mW/C C C
DEVICE MARKING
MMBV3700LT1=4R
ELECTRICAL CHARACTERISTICS(TA=25C unless otherwise noted)
Characteristic Reverse Breakdown Voltage (IR=10Adc) Diode Capacitance (V R=20 Vdc,f=1.0MHz) Series Resistance(figure5) (IF=10mAdc) Reverse Leakage Current (V R=150Vdc) Reverse Recovery Time (IF=IR=10mAdc) Symbol V (BR)R CT RS I
R
Min 200 -- -- -- --
Typ -- -- 0.7 -- 300
Max -- 1.0 1.0 0.1 --
Unit Vdc pF Adc ns
t rr
I9-1/2
LESHAN RADIO COMPANY, LTD.
MMBV3700LT1 MPN3700
TYPICAL CHARACTERISTICS
R S , SERIES RESISTANCE ( OHMS)
3.2
800
I F , FORWARD CURRENT ( mA )
2.8
700 600 500 400 300 200 100 0 0.7 0.8 0.9 1.0
TA = 25C
2.4 2.0 1.6 1.2 0.8 0.4 0 0 2.0 4.0 6.0 8.0 10 12 14 16
TA = 25C
I F , FORWARD CURRENT ( mA )
V F , FORWARD VOLTAGE ( VOLTS )
Figure 1. Series Resistance
Figure 2. Forward Voltage
C T , DIODE CAPACITANDE ( pF )
10 8.0 6.0
100 40
I R, REVERSE CURRENT (A)
4.0 2.0 1.0 0.8 0.6 0.4 0.2 0.1 0 - 10 - 20 - 30 - 40 - 50
10 4.0 1.0 0.4 0.1 0.04 0.01 0.004 0.001 - 60 - 20 0 +20 +60 +100 +140
T A = 25C
V R= 25Vdc
V R , FORWARD VOLTAGE ( VOLTS )
T A , AMBIENT TEMPERATURE (C)
Figure 3. Diode Capacitance
Figure 4. Leakage Current
I9-2/2


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